A preparation to allow bonding of fluoropolymer materials. Bond-PrepTM chemically etches the fluoropolymer surface, removing fluorine atoms and leaving active Bond sites for further processing such as adhesive bonding or electroless plating. Easier to use and emitting much less odour than conventional etchants, Bond-PrepTM is safer, having a vapour pressure one hundred times lower than common alternatives.
Bond-PrepTM is used in every sector of fluoropolymer processing from via preparation on printed circuit panels to PTFE sheet etching. Uniquely, we offer a comprehensive product range of nine products supplied in seven packaging arrangements to suit every application. A comprehensive technical support service including hands on operator training is available and we also supply complete, ready to run etching systems designed to your specification.